File:Thermal strain in thin films.png
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Size of this preview: 800 × 440 pixels. Other resolutions: 320 × 176 pixels | 640 × 352 pixels | 1,215 × 669 pixels.
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Summary
| Description |
English: Compressive stress is developed when the thermal expansion coefficient of the film is less than that of the substrate. Tensile stress is developed when the thermal expansion coefficient of the film is greater than that of the substrate. |
| Date | |
| Source | Own work |
| Author | AliyaK13 |
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This file is made available under the Creative Commons CC0 1.0 Universal Public Domain Dedication. |
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 03:07, 2 June 2025 | | 1,215 × 669 (60 KB) | wikimediacommons>AliyaK13 | Uploaded own work with UploadWizard |
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